The PCB knothole made technique and craft to contain very big variety, the PCB knothole electroplated a craft and turned along with the high function of electronics equipments and small scaled turn of fly soon a development, the main structure piece of electronics equipments prints to make circuit board, in order to adapt to the demand of high definition, high accuracy, miniaturization, involve among them of surface processing technique the variety is also very big.The purpose of electroplating lies in for manufacturing of printing and making the circuit board provide its not quite right and not proper surface characteristic.From the structure piece to print the surface processing of making the circuit board, though isnt only same, it electroplates oneself it the basic principle is same.Certainly print to make electroplating of circuit board opposite more simple, plate kind also less.Print to make circuit board chemistry to plate and electroplate of the main purpose is to ensure to print to make circuit board of can Han, protection and electrical conductivity with bear to whet sex.Printing to make a circuit board realization an electricity to pack path is an adoption tin Han and Rong Han.No matter is to connect a plug-in or a surface to stick to pack a piece, although the electricity packs of the craft method dont exert a homology, similar to the technique request that electroplates a layer.For print to make circuit board surface to plate a layer, it is most important can Han function, it is to promise to connect plug-in or surface to stick to pack piece and electric circuit place position to should attain to firmly combine.But credibility finally from weld circumstance decision.The modern produces a technique to usually adopt wave crest Han or immerse the Han carries on welding to up to thousand at the same time in printing to make circuit board, however because the electricity conjunction orders to anticipate mutually contiguous time with meltdown Han only 1, 2 seconds, therefore the surface of component is rapid but completely be anticipated by the Han smooth wet is very important.Hans anticipating is superficially expanded to make spare part surface smooth wet by the Han, at the same time because the capillary function makes Han anticipate to pierce through finally and be full of each part of point of contact but the completion weld process.If the at the beginning smooth wet function effect differs very much and then will produce defective Han to order or falsely Han.So, choice can the Han function well electroplate or Tu Fu Ceng is a count for much technique work.From long term of production fulfillment experience proof is new of the deposition lead tin metal alloy layer(tin content is 60%) can the Han is the best, this result that is the Han to measure after flotage tin.But because of the lead tin metal alloy deposit a stage to lead long, cause can the Han function descend, is weld also very difficult, especially deposit in the work environment condition of hot and damp under, the surface changes larger, weld more difficult.A lot of existing manufacturers develop a protection craft method.For all that, for adapting to an electronics equipments miniaturization, multi-function turned demand more, print to make a circuit board manufacturing technique continuously renewal, currently widespreadly adopt of SMOBC craft, still belong to heat to immerse a tin lead metal alloy(contain 63%, 37%) Tu Fu Ceng can the Han function is the tallest, its most important advantage is all ability smooth wet base metal have the conjunction of firmer and more stable metallurgy with radicle body thus and form Tu Fu Cengs surface of sheen.Because SMT uses to print the emergence of making the circuit board, in order to promise that the surface sticks to pack the sticking of spare part Han quality and sets out from the craft angle, development and develop new Tu Fu Ceng-prepare anti- heat to help Han and chemistry to immerse Nie|the surface Tu Fus crafts like gold,etc have already in great quantities applied to stick to pack two-sided and many layers to print to make circuit board in the surface up.In addition to electroplate or hot the metal alloy immersing a tin lead plate Tu Fu Ceng and other forerunners Tu Fu or electroplate a technique, for having the good electricity the contact function, print the plug part of making the circuit board to need to carry on a surface processing.Because this regardless equipments or instrument are how complicated, always save electricity to link a problem.The power importation needs to be linked, the electric circuit inner part of spare part and equipments also need more conjunctions, from large electronics equipments to the device of miniaturization, its effects be all decided by copular material and plate Tu Fu Cengs correct choice on the different degree and also say to choose point of contact surfaces plating a layer is very important and especially request that getting in touch with dint is small but the electric voltage print low the plug part of making the circuit board again it the important function is more outstanding.Print to make a circuit board manufacturing at present craft up adopt to plate a hard gold method or with that the Nie beats bottom of plate with gold or immerse a gold craft technique.The practical proof should plate the craft method of Nie gold suitable print to make circuit board plug to bear the technique request of whetting the function towards plating 1 F electricity and.
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